SMT (Surface Mount Technology) chip mounting processing is one of the important processing methods in modern electronic manufacturing industry. However, when executing the SMT machining process, various faults are often encountered. If these faults are not detected and resolved in a timely manner, it will bring great troubles and losses to production. Therefore, this article will introduce common faults and their solutions in SMT chip processing.
Fault 1: Component failed to complete correct position correction
Firstly, when processing chips, the processor creates a steel mesh based on the GERBER file. For small size or high-precision components, data alignment is usually used to complete position correction. However, if the standard position of the component is incorrect or the contour of the component is lost due to sample size, data alignment cannot be completed. Therefore, we should complete this task by adjusting the position in SMT chip processing. To solve this problem, we need to use high-precision and high-resolution open-loop translation machines to complete position matching during the SMT production process.
Fault 2: Unable to complete SMT patch at the specified location
Another common issue is that due to equipment wear or operator error, some patches cannot be processed correctly in the designated position. This issue is very common during SMT processing. In this case, manual calibration of the workbench position can be used, but the accuracy is limited. A more ideal solution is to use automated calibration methods. In these methods, a trigger switching method can be used to control the position of the chip processing through the trigger.