Rigid PCB

Single layer, double layers and multilayer Wide range of laminate, such as FR4, Aluminum base, copper base, Rogers RO4350, RO4003, RO3003, Arion 85N, 33N, VT47, Nelco N4000-13, Panaconic Megtron 4, Megtron 6, TU872, EM827, ISOLA IS410, FR408, Polyclad PCL370HR, etc.

HDI PCB

1. Multi-step HDI enables the connection between any layers; 2. Cross-layer laser processing could enhance the quality level of multi-step HDI; 3. The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enables the needs of high density and high frequency, high heat conducting, 3D assembly.

Metal core PCB

1.Multi laminating aluminum-based PCBs/ Soldering technology to cooper-base PCBs fulfill the needs of better heat radiating on multi-layer PCBs; 2.Buried magnetic core technology for metal-based PCBs with metal laminates in the middle enables heat radiating and also small size integration; 3.The technology of partially buried copper fulfills the needs of cost saving, small size integration and high radiating; 4.The design capability of concentric circles in metal base PCBs enables the isolation between fix holes and PTH holes in those PCBs; 5.The integrated coursing technology in metal base PCBs ensures the high reliability between metal base and epoxy resin or hydrocarbon laminates.

High Frequency Microwave PCBs

1.Multi-layer PTFE laminating enables super high frequency PCB; 2.Laser cutting technology for PTFE laminates could ensure the high accuracy of outlines; 3.Plasma excitation could improve the adhesion of cooper in PTH for those high-frequency laminates and hence improve the reliability of inner-outer layer connection; 4.Special techniques like stepped milling, laser blind-buried holes (HDI) are available for high-frequency PCB; 5.Our lamination technology enables the mixture of high-frequency laminates,high-speed laminates, FR4,PI, metal laminates and other materials.

Rigid-Flex PCB

1. Metal-plated holes and PTH Pad on FPC could realize build-buried holes connecting and soldering; 2. Isolated design of multi-layer flexible FPC could fulfill the needs of wide angle or dynamic bending; 3. Exposed FPC and IC stiffener enable the connection of placed components including modules or ICs at any angles; 4. FPC with electromagnetic shielding film fulfills the needs of the electrostatic shielding, magnetic shielding, low frequency alternating magnetic shielding and high frequency electromagnetic shielding; 5. laser blind holes on rigid-flex PCB enable the connection of any layers; Metal-laminated rigid-flex PCB enable better heat radiating.

Flexible PCB

Double-sided Flexible PCB Board PI + PI Steffener Material Type Coverlay Soldermask Type